Flexible epoxy resin polyamide adhesive

Component dosage /g component dosage /g
Bisphenol A epoxy resin 100

Alcohol-soluble polyamides [sebacic acid-1,6-diamine hexahydro-2Hazepine (azepine-2-one-1,6-hexanediamine adiacetate polycondensate)] 15
Diaminodiphenylmethane 20
Butene-ethylene-styrene copolymer elastomer 6

Preparation and Curing According to the amount of the above formulation, each component was dissolved in a methanol-toluene mixed solvent to prepare a binder solution and coated on a 75 μm polyimide film.
After 5 minutes semi-curing at 90°C. This semi-cured film was laminated with 28.35 g of a 75 μm copper foil and hot-pressed at 160° C. for 30 minutes to obtain a cured laminate.

The gel has excellent chemical properties, heat resistance, softness, and excellent electrical properties, and is used for heat-resistant conductive bonding.

Source: 21st Century Fine Chemicals Network